TSLC Corporation, which was established in 2013, became the world’s first 8” AIN wafer LED package manufacturer that employs the hybrid package technology for wavelengths ranging from ultraviolet short wavelength (280 nm) to visible light with long wavelengths including blue, green, red (660 nm) and invisible light as IR (920 nm). The company’s LEDs products are made based on aluminum nitride substrate that guarantees excellent thermal dissipation of packaged LEDs. Aside from the standard LED components, TSLC provides OEM and customized services to meet its clients’ demands. The company is targeting niche markets with stable profit performances, and emphasizes its core value to provide clients services they need.

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semiledsUS based developer and manufacture of ultra-high brightness LED chips with fabrication facilities in Taiwan and a Fab facility in China. SemiLEDs specialized in vertical LED chips in Blue (white), green and UV using a patented copper alloy base and Sapphire free bases making it more environmental friendly in production process and giving superior levels of energy efficiency, providing a lower total cost of ownership (TCO). indel visit ext

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SiBDI is a 100% subsidiary of SemiLEDs and using the MvpLED™ chip technology to it’s packaged product range.  The products we develop with American technology are designed and manufactured in Taiwan, integrating a strong local supply chain. The facility operates under a fully automated process in a clean environment. This results in a stable and high quality production line which makes the best quality products. The advantages of the patented and proprietary MvpLED™ design especially in Thermal management, and Optical efficacy, are realized in light quality, lifetime, color consistency, reliability and overall efficiency of the luminaire. Available in UV, Violet, Blue and Green, SemiLEDs high efficiency chips bring real benefits to any lamp or luminaire manufacturer. 

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